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1

A reliable and environmentally friendly packaging technology-flip-chip joining using anisotropically conductive adhesive

Liu, J., Tolvgard, A., Malmodin, J., Lai, Z.

Journal:

IEEE Transactions on Components and Packaging Technologies

Year:

1999

Language:

english

File:

PDF, 1.96 MB

english, 1999

2

[IEEE 3rd International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing 1998. Presented at Adhesives '98 - Binghamton, NY, USA (28-30 Sept. 1998)] Proceedings of 3rd International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing 1998 (Cat. No.98EX180) - A reliable and environmentally friendly packaging technology-flip chip joining using anisotropically conductive adhesive

Tolvgard, A., Malmodin, J., Liu, J., Lai, Z.

Year:

1998

Language:

english

File:

PDF, 1.26 MB

english, 1998

3

The Surfactant Flux—A New Flux for the Ozone Age

Becker, G., Biverstedt, A., Tolvgård, A.

Journal:

Microelectronics International

Year:

1988

Language:

english

File:

PDF, 206 KB

english, 1988

4

First line therapy in chronic lymphocytic leukemia: a Swedish nation-wide real-world study on 1053 consecutive patients treated between 2007 and 2013

Eketorp Sylvan, Sandra, Asklid, Anna, Johansson, Hemming, Klintman, Jenny, Bjellvi, Jenny, Tolvgård, Staffan, Kimby, Eva, Norin, Stefan, Andersson, Per-Ola, Karlsson, Claes, Karlsson, Karin, Lauri, Bi

Journal:

Year:

2018

Language:

english

File:

PDF, 271 KB

english, 2018